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flip-chip method

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  • Flip chip — Flip chip, also known as Controlled Collapse Chip Connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and MEMS, to external circuitry with solder bumps that have been deposited onto the chip pads …   Wikipedia

  • Flip-flop (electronics) — An SR latch, constructed from a pair of cross coupled NOR gates. Red and black mean logical 1 and 0 , respectively. In electronics, a flip flop or latch is a circuit that has two stable states and can be used to store state information. The… …   Wikipedia

  • Thermal copper pillar bump — The Thermal Copper Pillar Bump, also known as the thermal bump , is a thermoelectric device made from thin film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and… …   Wikipedia

  • Thermal management of high power LED — With the coming of energy saving era, high power light emitting diodes (LEDs) are promising to replace other technologies such as incandescent and fluorescent bulbs in signaling, solid state lighting, and vehicle headlight applications due to… …   Wikipedia

  • Integrated circuit — Silicon chip redirects here. For the electronics magazine, see Silicon Chip. Integrated circuit from an EPROM memory microchip showing the memory blocks, the supporting circuitry and the fine silver wires which connect the integrated circuit die… …   Wikipedia

  • Bahgat G. Sammakia — is an Egyptian American mechanical engineer. He is currently a professor of mechanical engineering and director of both the Integrated Electronics Engineering Center and the Small Scale Systems Packaging Center at Binghamton University a part of… …   Wikipedia

  • Semiconductor device fabrication — Semiconductor manufacturing processes 10 µm 1971 3 µm 1975 1.5 µm 1982 …   Wikipedia

  • Micro-FCBGA — (Flip Chip Ball Grid Array) is Intel s current[when?] BGA mounting method for mobile processors that use a flip chip binding technology. It was introduced with the Coppermine Mobile Celeron and replaces the older BGA2 ball grid array mounting… …   Wikipedia

  • Radeon R300 — ATIGPU name = Radeon 9500 X600 Series codename = Khan created = 2002 entry = Radeon 9550, X300 midrange = Radeon 9500, 9600, X550, X600 highend = Radeon 9700, 9800 d3dversion = 9.0, Shader Model 2.0The Radeon R300 (introduced August 2002) is the… …   Wikipedia

  • Three-dimensional integrated circuit — In electronics, a three dimensional integrated circuit (3D IC, 3D IC, or 3 D IC) is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The semiconductor… …   Wikipedia

  • Hardwired control — To execute instructions, a computer s processor must generate the control signals used to perform the processor s actions in the proper sequence. This sequence of actions can either be executed by another processor s software (for example in… …   Wikipedia

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